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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11174157 B1

PDFFull Text
Date of Patent:
Nov. 16, 2021

Filed:

Jun. 25, 2019

Semiconductor device packages and methods of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Chi Sheng Tseng, Kaohsiung, TW;

Lu-Ming Lai, Kaohsiung, TW;

Yu-Hsuan Tsai, Kaohsiung, TW;

Yin-Hao Chen, Kaohsiung, TW;

Hsin Lin Wu, Kaohsiung, TW;

San-Kuei Yu, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Victoria K Hall

Int. Cl.
CPC ...
B81C 1/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81B 7/0006 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); B81B 2207/07 (2013.01); B81B 2207/095 (2013.01); B81C 2203/035 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/9201 (2013.01);
Abstract

A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.

Find Patent Forward Citations

Tseng, Chi. (2021). Semiconductor device packages and methods of manufacturing the same (U.S. Patent No. 11174157). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11174157

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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