The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Dec. 19, 2018
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Johannes Stahr, St. Lorenzen, AT;
Mike Morianz, Graz, AT;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 3/26 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/5389 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 24/96 (2013.01); H05K 1/0298 (2013.01); H05K 1/189 (2013.01); H05K 3/0055 (2013.01); H05K 3/26 (2013.01); H05K 3/46 (2013.01); H01L 23/5384 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/244 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/8201 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/82359 (2013.01); H01L 2224/82379 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H05K 1/115 (2013.01); H05K 3/0035 (2013.01); H05K 3/0038 (2013.01); H05K 3/108 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2203/0392 (2013.01); H05K 2203/125 (2013.01);
Abstract
A method for producing a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layer are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.