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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11171170 B1

PDFFull Text
Expired
Date of Patent:
Nov. 09, 2021

Filed:

Jul. 14, 2016

Image sensor package with flexible printed circuits

Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Yuta Momiuchi, Kanagawa, JP;

Yuji Takaoka, Kanagawa, JP;

Kiyohisa Tanaka, Kanagawa, JP;

Eiichirou Kishida, Kumamoto, JP;

Emi Nishioka, Nagasaki, JP;

Naoki Yamashita, Kumamoto, JP;

Hirokazu Seki, Oita, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:

Chip Law Group

Primary Examiner:

Shih Tsun A Chou

Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01); H01L 23/00 (2006.01); H04N 5/335 (2011.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 27/14 (2013.01); H01L 27/14618 (2013.01); H04N 5/2253 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/4985 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/152 (2013.01); H01L 2924/15159 (2013.01); H04N 5/335 (2013.01);
Abstract

The present technology relates to a semiconductor device including: a solid-state image sensor having a pixel array unit in which a plurality of pixels each having a photoelectric conversion element is two-dimensionally arranged in a matrix; and a flexible printed circuit having wiring adapted to connect a pad portion provided on an upper surface side to be located on a light receiving surface side of the solid-state image sensor to an external terminal provided on a lower surface side opposite to the upper surface side, in which the flexible printed circuit is arranged along respective surfaces of the solid-state image sensor such that a position of an end portion located on the upper surface side becomes a position different from a position in a space above the light receiving surface.

Find Patent Forward Citations

Momiuchi, Yuta. (2021). Image sensor package with flexible printed circuits (U.S. Patent No. 11171170). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11171170

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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