The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Jan. 28, 2020
Sandisk Technologies Llc, Addison, TX (US);
Ramy Nashed Bassely Said, San Jose, CA (US);
Raghuveer S. Makala, Campbell, CA (US);
Senaka Kanakamedala, San Jose, CA (US);
Fei Zhou, San Jose, CA (US);
Yao-Sheng Lee, Tampa, FL (US);
SANDISK TECHNOLOGIES LLC, Addison, TX (US);
Abstract
A bonded assembly includes a first semiconductor die containing a first substrate, first semiconductor devices, and first bonding pads that are electrically connected to a respective node of the first semiconductor devices, a second semiconductor die containing a second substrate, second semiconductor devices, and second bonding pads that are electrically connected to a respective node of the second semiconductor devices and bonded to a respective one of the first bonding pads, and at least one metal-organic framework (MOF) dielectric layer that laterally surrounds at least one of the first bonding pads and the second bonding pads.