The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2021
Filed:
Dec. 04, 2019
International Business Machines Corporation, Armonk, NY (US);
Mukta Ghate Farooq, Hopewell Junction, NY (US);
James J. Kelly, Schenectady, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Techniques for simultaneously plating features of varying sizes on a semiconductor substrate are provided. In one aspect, a method for electroplating includes: placing a shield over a wafer, offset from a surface of the wafer, which covers portions of the wafer and leaves other portions of the wafer uncovered; and depositing at least one metal onto the wafer by electroplating to simultaneously form metallurgical features of varying sizes on the wafer based on the shield altering local deposition rates for the portions of the wafer covered by the shield. An electroplating apparatus is also provided.