The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Feb. 05, 2020
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Xiaoyong Liu, San Jose, CA (US);

Quang Le, San Jose, CA (US);

Hongquan Jiang, San Jose, CA (US);

Guangli Liu, Pleasanton, CA (US);

Jui-lung Li, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/235 (2006.01); G11B 5/31 (2006.01); G11B 5/127 (2006.01); G11B 5/39 (2006.01); G11B 5/00 (2006.01); G03F 7/20 (2006.01); G11B 5/48 (2006.01);
U.S. Cl.
CPC ...
G11B 5/235 (2013.01); G11B 5/1278 (2013.01); G11B 5/314 (2013.01); G11B 5/315 (2013.01); G11B 5/3133 (2013.01); G11B 5/3146 (2013.01); G03F 7/2043 (2013.01); G11B 5/3938 (2013.01); G11B 5/4826 (2013.01); G11B 2005/0024 (2013.01);
Abstract

A magnetic recording write head includes a spin torque oscillator (STO) between a seed layer disposed on a write pole and trailing shield. The seed layer has a cross-track width greater than the width of the STO and a depth in a direction orthogonal to the disk-facing surface of the write pole greater than the depth of the STO. A first insulating refill layer is formed on the sides of the seed layer and STO, and a second insulating refill layer in contact with the first refill layer has a thermal conductivity greater than that of the first refill layer. When current is passing through the STO, the seed layer spreads the current to reduce heating of the write pole and STO, and the bilayer refill material facilitates the transfer of heat away from the write pole and STO.


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