The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Apr. 06, 2020
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Nobuyuki Kimura, Tokyo, JP;

Keiji Nomaru, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01); B24B 49/12 (2006.01); B24B 7/22 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G01B 11/0675 (2013.01); B24B 7/228 (2013.01); B24B 49/12 (2013.01); G01B 11/0625 (2013.01); H01L 21/67253 (2013.01);
Abstract

A thickness measuring apparatus for measuring the thickness of a workpiece held on a chuck table includes the followings: a light source configured to emit white light; an optical branching unit configured to branch, to a second optical path, reflected light applied from the light source to the workpiece held on the chuck table via a first optical path and reflected from the workpiece; a diffraction grating disposed in the second optical path; an image sensor configured to detect an optical intensity signal of light separated into each wavelength by the diffraction grating; and a thickness output unit configured to generate a spectral interference waveform on the basis of the optical intensity signal detected by the image sensor, determine the thickness on the basis of the spectral interference waveform, and output the thickness.


Find Patent Forward Citations

Loading…