The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Feb. 06, 2020
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Jeyavel Velmurugan, Gaithersburg, MD (US);

Bryan L. Buckalew, Tualatin, OR (US);

Thomas A. Ponnuswamy, Sherwood, OR (US);

Assignee:

Lam Research Comporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 7/12 (2006.01); C25D 3/56 (2006.01); C25D 17/00 (2006.01); C25D 5/34 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 3/562 (2013.01); C25D 5/34 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); H01L 21/2885 (2013.01); H01L 21/76861 (2013.01); H01L 21/76873 (2013.01); H01L 21/76879 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/53238 (2013.01);
Abstract

In one example, an electroplating system comprises a bath reservoir, a holding device, an anode, a direct current power supply, and a controller. The bath reservoir contains an electrolyte solution. The holding device holds a wafer submerged in the electrolyte solution. The wafer comprises features covered by a cobalt layer. The anode is opposite to the wafer and submerged in the electrolyte solution. The direct current power supply generates a direct current between the holding device and the anode. A combination of forward and reverse pulses is applied between the holding device and the anode to electroplate a copper layer on the cobalt layer of the wafer.


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