The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Jan. 27, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Shogo Mochizuki, Clifton Park, NY (US);

Nicolas Loubet, Guilderland, NY (US);

Zhenxing Bi, Dunn Loring, VA (US);

Richard A. Conti, Altamont, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/417 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01L 29/41733 (2013.01); H01L 29/66742 (2013.01); H01L 29/78618 (2013.01);
Abstract

Provided are embodiments of a method for forming a semiconductor device. The method includes forming a nanosheet stack on a substrate, wherein the nanosheet stack comprises channel layers and nanosheet layers, forming a sacrificial gate over the nanosheet stack, and forming trenches to expose sidewalls of the nanosheet stack. The method also includes forming source/drain (S/D) regions, where forming the S/D regions including forming first portions of the S/D regions on portions of the nano sheet stack, forming second portions of the S/D regions, wherein the first portions are different than the second portions, and replacing the sacrificial gate with a conductive gate material. Also provided are embodiments of a semiconductor device formed by the method described herein.


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