The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Nov. 05, 2020
Applicant:

Powertech Technology Inc., Hsinchu County, TW;

Inventors:

Cheng Chang, Hsinchu County, TW;

Ming Hsiu Hsieh, Hsinchu County, TW;

Yuan-Jung Lu, Hsinchu County, TW;

Chu Yuan Mo, Hsinchu County, TW;

Fu-Hsiang Chang, Hsinchu County, TW;

Assignee:

Powertech Technology Inc., Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 15/06 (2006.01); H01L 21/683 (2006.01); B25J 11/00 (2006.01); B25J 15/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B25J 11/0095 (2013.01); B25J 15/0033 (2013.01); B25J 15/0616 (2013.01); B25J 15/0683 (2013.01);
Abstract

A wafer transferring device adapted to suck and transfer a first wafer is provided. The wafer transferring device includes an arm and a supporting carrier. The supporting carrier is connected to the arm. The supporting carrier has a single vacuum suction port exposed to an upper surface of the supporting carrier. The supporting carrier is adapted to move to a position below the first wafer. The single vacuum suction port is adapted to suck a first central region of the first wafer so as to lift up and transfer the first wafer.


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