The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Jun. 05, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sang Won Kang, San Jose, CA (US);

Nicholas Celeste, Oakland, CA (US);

Dmitry Lubomirsky, Cupertino, CA (US);

Peter Hillman, San Jose, CA (US);

Douglas Brenton Hayden, San Jose, CA (US);

Dongqing Yang, Pleasanton, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); H01J 37/32357 (2013.01); H01J 37/32449 (2013.01); H01J 37/32522 (2013.01); H01J 37/32724 (2013.01); H01J 37/32862 (2013.01);
Abstract

Embodiments of the present disclosure generally provide improved methods for processing substrates with improved process stability, increased mean wafers between clean, and/or improved within wafer uniformity. One embodiment provides a method for seasoning one or more chamber components in a process chamber. The method includes placing a dummy substrate in the process chamber, flowing a processing gas mixture to the process chamber to react with the dummy substrate and generate a byproduct on the dummy substrate, and annealing the dummy substrate to sublimate the byproduct while at least one purge conduit of the process chamber is closed.


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