The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Sep. 05, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Youji Kawasaki, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/20 (2006.01); B29C 43/58 (2006.01); B29C 33/42 (2006.01); H01L 21/3105 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 33/424 (2013.01); B29C 43/58 (2013.01); G03F 7/70775 (2013.01); G03F 7/70825 (2013.01); G03F 7/70925 (2013.01); H01L 21/31051 (2013.01); H01L 21/67259 (2013.01);
Abstract

There is provided a planarization apparatus that planarizes composition in a specified region on a substrate using a planar section of a mold. The planarization apparatus includes a mold holding unit configured to hold the mold, a measurement unit configured to measure a shape of the planar section of the mold held by the mold holding unit and convexly deformed, and a control unit configured to align, based on a result of measurement by the measurement unit, the planar section of the mold and the substrate with respect to a direction along a surface of the substrate so as to bring the planar section of the mold into contact with the specified region on the substrate, and bring the mold and the composition into contact with each other.


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