The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Oct. 28, 2020
Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventors:

Norikatsu Sasao, Kanagawa, JP;

Koji Asakawa, Kanagawa, JP;

Tomoaki Sawabe, Tokyo, JP;

Shinobu Sugimura, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 153/00 (2006.01); C08F 20/28 (2006.01); C09D 125/06 (2006.01); C09D 133/14 (2006.01); C08F 12/08 (2006.01); G03F 7/00 (2006.01); B05D 5/00 (2006.01);
U.S. Cl.
CPC ...
C09D 153/00 (2013.01); B05D 5/00 (2013.01); C08F 12/08 (2013.01); C08F 20/28 (2013.01); C09D 125/06 (2013.01); C09D 133/14 (2013.01); G03F 7/0002 (2013.01);
Abstract

According to one embodiment, a pattern formation method is disclosed. The method includes a preparation process, a block copolymer layer formation process, and a contact process. The preparation process includes preparing a pattern formation material including a block copolymer including a first block and a second block. The first block includes a first main chain and a plurality of first side chains. At least one of the first side chains includes a plurality of carbonyl groups. The block copolymer layer formation process includes forming a block copolymer layer on a first member. The block copolymer layer includes the pattern formation material and includes a first region and a second region. The first region includes the first block. The second region includes the second block. The contact process includes causing the block copolymer layer to contact a metal compound including a metallic element.


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