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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11158599 B1

PDFFull Text
Date of Patent:
Oct. 26, 2021

Filed:

Apr. 08, 2019

Method for manufacturing electronic device

Applicants:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Tatsuya Kazama, Tokyo, JP;

Tomohisa Kawanago, Tokyo, JP;

Takahiro Nishizaki, Tokyo, JP;

Assignees:

SUMITOMO BAKELITE CO., LTD., Tokyo, JP;

SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Devang R Patel

Int. Cl.
CPC ...
H01L 23/00 (2006.01); C08L 63/00 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); C08L 93/04 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); B23K 1/008 (2013.01); B23K 35/362 (2013.01); B23K 35/3613 (2013.01); C08L 63/00 (2013.01); C08L 93/04 (2013.01); B23K 2101/40 (2018.08); H01L 2224/81002 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01);
Abstract

The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent. In a case where SP1 represents a Hansen's method-based average solubility parameter of a resin group consisting of the epoxy resin and the phenolic resin curing agent in the resin composition, and Mn1 represents a number average molecular weight of the resin group, SP1 and Mn1 satisfy Mn1≤210×SP1−4,095.

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