The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Apr. 17, 2019
Nanya Technology Corporation, New Taipei, TW;
Chang-Chun Hsieh, Huatan Township, Changhua County, TW;
Wu-Der Yang, Taoyuan, TW;
Ching-Feng Chen, New Taipei, TW;
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Abstract
The present disclosure relates to a semiconductor structure and a method of manufacturing the semiconductor structure. The semiconductor structure includes a substrate including a first surface and a conductive trace extending over the substrate; a die disposed over the first surface of the substrate; a molding disposed over the first surface of the substrate and covering the die; and a metallic layer surrounding the molding and the substrate, wherein the metallic layer is electrically connected to at least a portion of the conductive trace exposed through the substrate.