The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Jul. 30, 2019
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Hiromichi Gohara, Matsumoto, JP;

Takafumi Yamada, Matsumoto, JP;

Yuta Tamai, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 23/043 (2006.01); H01L 25/07 (2006.01); H02K 11/33 (2016.01); B60R 16/033 (2006.01); B60R 16/08 (2006.01); H02K 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); B60R 16/033 (2013.01); B60R 16/08 (2013.01); H01L 23/043 (2013.01); H01L 23/473 (2013.01); H01L 25/072 (2013.01); H02K 7/006 (2013.01); H02K 11/33 (2016.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.


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