The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Jun. 11, 2020
Applicant:

Ap Memory Technology Corp., Zhubei, TW;

Inventors:

Wen Liang Chen, Zhubei, TW;

Lin Ma, Zhubei, TW;

Chien-An Yu, Zhubei, TW;

Chun Yi Lin, Zhubei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 25/18 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); H01L 22/10 (2013.01); H01L 23/5226 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/18 (2013.01);
Abstract

A semiconductor device includes a first semiconductor portion and a second semiconductor portion. The first semiconductor portion provides a plurality of memory components, including a first substrate layer, a plurality of first interconnect conductive layers, a plurality of first conductive vias, and a plurality of first conductive contacts. The first conductive contacts electrically connect to the first conductive vias, and the first conductive contacts in combination with the first conductive vias are formed on a top first interconnect conductive layer of the first interconnect conductive layers. The second semiconductor portion provides a control circuit, including a second substrate layer and a plurality of second interconnect conductive layers. The first and second semiconductor portions are stacked vertically with one another, so that the first conductive contacts are electrically connected to the control circuit, and the first conductive contacts in combinations with the first conductive vias form a plurality of transmission channels.


Find Patent Forward Citations

Loading…