The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Jan. 07, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Daniel James Dechene, Watervliet, NY (US);

Timothy Mathew Philip, Albany, NY (US);

Somnath Ghosh, Clifton Park, NY (US);

Robert Robison, Rexford, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/31144 (2013.01); H01L 21/31111 (2013.01);
Abstract

A method includes forming a dielectric layer on a semiconductor substrate, forming a hard mask layer on the dielectric layer, forming a sacrificial mandrel layer on the hard mask layer, depositing a sacrificial fill material in an opening in the sacrificial mandrel layer and utilizing the sacrificial fill material to selectively pattern the hard mask layer. The pattern defining first and second spaced openings in the hard mask layer. The method further includes etching the dielectric layer through the first and second openings in the hard mask layer to create first and second trenches in the dielectric layer separated by a dielectric segment of the dielectric layer.


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