The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Jun. 14, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Alan Roth, Leander, TX (US);
Eric Soenen, Austin, TX (US);
Ying-Chih Hsu, Hsinchu, TW;
Nick Samra, Austin, TX (US);
Stefan Rusu, Sunnyvale, CA (US);
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01L 23/00 (2006.01); H01F 41/04 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0006 (2013.01); H01F 17/04 (2013.01); H01F 41/046 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01F 2017/048 (2013.01); H01L 21/568 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19042 (2013.01);
Abstract
An inductor is formed in an IC device packaging structure. The structure includes an encapsulating material, with a ferromagnetic core in the encapsulation material. A plurality of metal layers are provided in the encapsulation material forming an inductor coil extending around the ferromagnetic core so as to form an inductor.