The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Jul. 14, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Vivek Raghunathan, Tempe, AZ (US);
Myung Jin Yim, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01L 25/16 (2006.01); G02B 6/132 (2006.01); G02B 6/122 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4206 (2013.01); G02B 6/122 (2013.01); G02B 6/132 (2013.01); G02B 6/42 (2013.01); G02B 6/428 (2013.01); G02B 6/4212 (2013.01); G02B 6/4225 (2013.01); H01L 25/167 (2013.01);
Abstract
Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.