The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Sep. 20, 2018
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Teruo Yoshino, Toyama, JP;

Takeshi Yasui, Toyama, JP;

Masaki Murobayashi, Toyama, JP;

Koichiro Harada, Toyama, JP;

Tadashi Terasaki, Toyama, JP;

Masanori Nakayama, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/52 (2006.01); C23C 16/505 (2006.01); H05H 1/46 (2006.01); H01J 37/32 (2006.01); C23C 16/458 (2006.01); C23C 16/44 (2006.01);
U.S. Cl.
CPC ...
C23C 16/505 (2013.01); C23C 16/44 (2013.01); C23C 16/4583 (2013.01); C23C 16/52 (2013.01); H01J 37/321 (2013.01); H01J 37/3244 (2013.01); H01L 21/02238 (2013.01); H01L 21/02252 (2013.01); H01L 21/02274 (2013.01); H05H 1/46 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes: loading a substrate into a substrate process chamber having a plasma generation space in which a processing gas is plasma-excited and a substrate process space communicating with the plasma generation space; mounting the substrate on a substrate mounting table installed inside the substrate process space; adjusting a height of the substrate mounting table so that the substrate is located at a height lower than a lower end of a coil, the coil configured to wind around an outer periphery of the plasma generation space so as to have a diameter larger than a diameter of the substrate; supplying the processing gas to the plasma generation space; plasma-exciting the processing gas supplied to the plasma generation space by supplying a high-frequency power to the coil to resonate the coil; and processing the substrate mounted on the substrate mounting table by the plasma-excitation.


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