The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Jan. 08, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Mayu Felicia Yamamura, San Carlos, CA (US);

Jason Garcheung Fung, Santa Clara, CA (US);

Daniel Redfield, Morgan Hill, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Hou T. Ng, Campbell, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/26 (2012.01); B24D 18/00 (2006.01); B29C 64/393 (2017.01); B29C 64/112 (2017.01); B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); B24B 37/20 (2012.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 37/20 (2013.01); B24D 18/009 (2013.01); B29C 64/112 (2017.08); B29C 64/165 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); B29L 2031/736 (2013.01);
Abstract

A method of fabricating a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection. The desired shape defines a profile including a polishing surface and one or more grooves on the polishing pad. Data indicative of a modified pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the modified pattern.


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