The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Nov. 01, 2019
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Katsuhiko Suzuki, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/303 (2013.01); H05K 3/0044 (2013.01);
Abstract

A wiring board manufacturing method includes a sheet laminate forming step of impregnating a glass cloth with a synthetic resin to form a plurality of sheets and next stacking these sheets to form a sheet laminate having a first surface and a second surface, a core member forming step of stacking a release plate on the first surface of the sheet laminate, stacking an electrode plate on the second surface of the sheet laminate, next using a pressure plate to press the release plate, the sheet laminate, and the electrode plate in their stacked condition, thereby uniting them together to form a core member, and a grinding step of grinding the release plate of the core member in a condition where the electrode plate of the core member is held on a chuck table, thereby making a thickness of the core member uniform.


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