The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Dec. 10, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Jr-Wei Lin, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 31/153 (2006.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/153 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01);
Abstract
A semiconductor package structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a substrate and a circuit. The substrate has a first portion and a second portion. A first thickness of the first portion is greater than a second thickness of the second portion. The circuit is disposed on the second portion of the substrate. The second semiconductor device is disposed on the circuit of the first semiconductor device.