The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Jun. 01, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Zhi-Qiang Wu, Chubei, TW;

Chun-Fu Cheng, Zhubei, TW;

Chung-Cheng Wu, Ju-Bei, TW;

Yi-Han Wang, Beigang Township, Yunlin County, TW;

Chia-Wen Liu, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/10 (2006.01); H01L 29/775 (2006.01); H01L 29/786 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 25/065 (2006.01); H01L 21/02 (2006.01); H01L 25/04 (2014.01); H01L 29/08 (2006.01); H01L 29/06 (2006.01); H01L 27/06 (2006.01); H01L 29/40 (2006.01); H01L 29/78 (2006.01); B82Y 99/00 (2011.01); B82Y 10/00 (2011.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/02008 (2013.01); H01L 21/823807 (2013.01); H01L 25/043 (2013.01); H01L 27/0617 (2013.01); H01L 27/092 (2013.01); H01L 29/0673 (2013.01); H01L 29/0847 (2013.01); H01L 29/1054 (2013.01); H01L 29/401 (2013.01); H01L 29/42376 (2013.01); H01L 29/42392 (2013.01); H01L 29/66 (2013.01); H01L 29/66439 (2013.01); H01L 29/775 (2013.01); H01L 29/7853 (2013.01); H01L 29/78696 (2013.01); B82Y 10/00 (2013.01); B82Y 99/00 (2013.01); H01L 21/823814 (2013.01);
Abstract

A method includes forming a stacked structure of a plurality of first semiconductor layers and a plurality of second semiconductor layers alternately stacked in a first direction over a substrate, the first semiconductor layers being thicker than the second semiconductor layers. The method also includes patterning the stacked structure into a first fin structure and a second fin structure extending along a second direction substantially perpendicular to the first direction. The method further includes removing the first semiconductor layers of the first fin structure to form a plurality of nanowires. Each of the nanowires has a first height, there is a distance between two adjacent nanowires along the vertical direction, and the distance is greater than the first height. The method includes forming a first gate structure between the second semiconductor layers of the first fin structure.


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