The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Oct. 25, 2019
Applicant:
Stmicroelectronics, Inc., Calamba, PH;
Inventors:
Rennier Rodriguez, Bulacan, PH;
Rammil Seguido, Malolos, PH;
Raymond Albert Narvadez, Sta. Rosa, PH;
Michael Tabiera, Cabuyao, PH;
Assignee:
STMicroelectronics, Inc., Calamba, PH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 24/43 (2013.01);
Abstract
The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.