The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Jun. 05, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Liang-Yao Lee, Taoyuan, TW;

Tsung-Chieh Tsai, Chu-Bei, TW;

Juing-Yi Wu, Hsinchu, TW;

Chun-Yi Lee, Beipu Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 29/49 (2006.01); H01L 27/02 (2006.01); G06F 30/39 (2020.01); H01L 29/06 (2006.01); H01L 23/528 (2006.01); G06F 30/398 (2020.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); G06F 30/39 (2020.01); G06F 30/398 (2020.01); H01L 23/5226 (2013.01); H01L 29/4916 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has a plurality of gate structures disposed over a substrate. A plurality of metal structures continuously extend from lower surfaces contacting the plurality of gate structures to upper surfaces contacting one or more interconnects within an overlying conductive interconnect layer. The plurality of metal structures are arranged at a first pitch that is larger than a second pitch of the plurality of gate structures.


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