The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Apr. 13, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Hariklia Deligianni, Alpine, NJ (US);

William J. Gallagher, Ardsley, NY (US);

Yu Luo, Hopewell Junction, NY (US);

Lubomyr T. Romankiw, Briancliff Manor, NY (US);

Joonah Yoon, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/50 (2006.01); H01F 1/153 (2006.01); H01F 41/04 (2006.01); H01F 10/30 (2006.01); H01F 10/16 (2006.01); H01F 41/24 (2006.01);
U.S. Cl.
CPC ...
H01F 1/15308 (2013.01); C23C 18/50 (2013.01); H01F 10/16 (2013.01); H01F 10/30 (2013.01); H01F 41/046 (2013.01); H01F 41/24 (2013.01); H01F 1/15333 (2013.01);
Abstract

Present disclosure relates to magnetic materials, chips having magnetic materials, and methods of forming magnetic materials. In certain embodiments, magnetic materials may include a seed layer, and a cobalt-based alloy formed on seed layer. The seed layer may include copper, cobalt, nickel, platinum, palladium, ruthenium, iron, nickel alloy, cobalt-iron-boron alloy, nickel-iron alloy, and any combination of these materials. In certain embodiments, the chip may include one or more on-chip magnetic structures. Each on-chip magnetic structure may include a seed layer, and a cobalt-based alloy formed on seed layer. In certain embodiments, method may include: placing a seed layer in an aqueous electroless plating bath to form a cobalt-based alloy on seed layer. In certain embodiments, the aqueous electroless plating bath may include sodium tetraborate, an alkali metal tartrate, ammonium sulfate, cobalt sulfate, ferric ammonium sulfate and sodium borohydride and has a pH between about 9 to about 13.


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