The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Jun. 18, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventor:

Brian J. Long, Folsom, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 7/10 (2006.01); H05K 7/20 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/13 (2006.01); H01L 23/22 (2006.01); H01L 23/24 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/367 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01); H05K 1/14 (2006.01); H01L 23/427 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); G06F 1/181 (2013.01); G06F 1/203 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/4006 (2013.01); H05K 1/021 (2013.01); H05K 1/0215 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 3/36 (2013.01); H05K 7/20336 (2013.01); H05K 7/20818 (2013.01); H01L 23/427 (2013.01); H01L 23/49816 (2013.01); H01L 23/5385 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15321 (2013.01); H05K 1/0209 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/042 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10734 (2013.01);
Abstract

Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.


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