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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11145597 B1

PDFFull Text
Date of Patent:
Oct. 12, 2021

Filed:

Jul. 08, 2019

Semiconductor device and method of manufacturing the same

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Shinichi Kuwabara, Ibaraki, JP;

Yasutaka Nakashiba, Ibaraki, JP;

Teruhiro Kuwajima, Ibaraki, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

John A Bodnar

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/762 (2006.01); H01L 21/8238 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 27/092 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/76224 (2013.01); H01L 21/76802 (2013.01); H01L 21/823871 (2013.01); H01L 21/823878 (2013.01); H01L 23/49575 (2013.01); H01L 23/528 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 27/0688 (2013.01); H01L 27/0928 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49176 (2013.01);
Abstract

A semiconductor device includes a first semiconductor chip on which a first circuit is formed and a second semiconductor chip on which two circuits are formed. In the first semiconductor chip, a first inductor on the transmitting side electrically connected with the first circuit and a second inductor on the receiving side electrically connected with the second circuit via the bonding wire are formed. In plan view, the first inductor and the second inductor are disposed so as not to overlap each other, and are arranged along each other.

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Kuwabara, Shinichi. (2021). Semiconductor device and method of manufacturing the same (U.S. Patent No. 11145597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11145597

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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