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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11145571 B1

PDFFull Text
Date of Patent:
Oct. 12, 2021

Filed:

Jul. 16, 2019

Heat transfer for power modules

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Inpil Yoo, Unterhaching, DE;

Jerome Teysseyre, Scottsdale, AZ (US);

Seungwon Im, Seoul, KR;

Dongwook Kang, Bucheon-si, KR;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

Brake Hughes Bellermann LLP

Primary Examiner:

Earl N Taylor

Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 25/065 (2006.01); H01L 21/48 (2006.01); H01L 23/40 (2006.01); H05K 7/20 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4882 (2013.01); H01L 23/3121 (2013.01); H01L 23/4006 (2013.01); H01L 25/0655 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01);
Abstract

In one general aspect, an apparatus can include a substrate, a semiconductor die coupled with a first surface of the substrate, and a metal layer disposed on a second surface of the substrate. The second surface can be opposite the first surface. The apparatus can also include a plurality of metal fins coupled with the metal layer, and a metal ring coupled with the metal layer. The metal ring can surround the plurality of metal fins.

Find Patent Forward Citations

Yoo, Inpil. (2021). Heat transfer for power modules (U.S. Patent No. 11145571). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11145571

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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