The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Sep. 27, 2019
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Jin-Wei You, Taichung, TW;

Cheng-Kai Chang, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); G01J 1/02 (2006.01); H04B 3/32 (2006.01);
U.S. Cl.
CPC ...
G01J 1/0204 (2013.01); H04B 3/32 (2013.01);
Abstract

The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.


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