The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

May. 30, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Shinichiro Misaka, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/46 (2006.01); H01L 21/027 (2006.01); H01L 21/205 (2006.01); C23C 16/02 (2006.01); H01L 21/68 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/463 (2013.01); C23C 16/0209 (2013.01); C23C 16/46 (2013.01); H01L 21/027 (2013.01); H01L 21/205 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/67259 (2013.01); H01L 21/68 (2013.01);
Abstract

A substrate processing apparatus that places a substrate on a placing portion and performs a heating processing on the substrate includes a plurality of heating control regions that are set plurally along a circumferential direction of the placing portion to heat the substrate placed on the placing portion, and are independently controlled in temperature, and an adjusting unit that adjusts a relative direction of a circumferential direction of the substrate with respect to an arrangement of the circumferential direction of the plurality of heating control regions based on information on deformation of the substrate different in height from a plane orthogonal to a center axis of the substrate in the circumferential direction.


Find Patent Forward Citations

Loading…