The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jan. 15, 2020
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Shinichi Kuwabara, Ibaraki, JP;
Yasutaka Nakashiba, Ibaraki, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/49822 (2013.01); H01L 25/0655 (2013.01); H01L 27/22 (2013.01);
Abstract
A semiconductor module includes a semiconductor chip including wiring formed over a semiconductor element such as a MISFET, a sealing resin part MR covering the semiconductor chip such that the wiring is exposed, and an inductor formed in redistribution wiring. The inductor overlaps with the sealing resin part covering at least a side surface of the semiconductor chip in plan view.
Kuwabara, Shinichi. (2021). Semiconductor module and method of manufacturing the same (U.S. Patent No. 11139240). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11139240
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile