The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Apr. 29, 2020
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
David Craig Oram, Fremont, CA (US);
Abhinav Mathur, San Jose, CA (US);
Kenong Wu, Davis, CA (US);
Eugene Shifrin, Sunnyvale, CA (US);
Assignee:
KLA-TENCOR CORPORATION, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01N 21/88 (2006.01); H01L 21/67 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G01N 21/8806 (2013.01); H01L 21/67288 (2013.01); H01L 22/20 (2013.01); G01N 21/9501 (2013.01); G01N 2021/8825 (2013.01); G01N 2021/8848 (2013.01); G01N 2021/8883 (2013.01);
Abstract
A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.