The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jul. 20, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Lei Zhong, Niskayuna, NY (US);
Ho-yung David Hwang, Cupertino, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/0254 (2013.01); H01L 21/02532 (2013.01); H01L 21/02554 (2013.01); H01L 21/76816 (2013.01); H01L 21/76837 (2013.01); H01L 21/76879 (2013.01);
Abstract
Described are semiconductor devices, methods of manufacturing, and methods for device patterning. More particularly, a subtractive interconnect patterning method is described. A subtractive interconnect patterning is used in place of damascene interconnect patterning.