The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Sep. 27, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Chanro Park, Clifton Park, NY (US);
Koichi Motoyama, Clifton Park, NY (US);
Kenneth C. K. Cheng, Albany, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 21/30608 (2013.01); H01L 21/76831 (2013.01); H01L 21/76849 (2013.01); H01L 21/76885 (2013.01); H01L 21/76897 (2013.01); H01L 23/5226 (2013.01);
Abstract
Integrated chips and methods of forming the same include forming upper dummy lines over lower conductive lines. The lower conductive lines are recessed to form conductive vias between the lower conductive lines and the upper dummy lines. The upper dummy lines are replaced with upper conductive lines that contact the conductive vias.