The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

May. 24, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tsui-Wei Wang, Hsinchu, TW;

Yung-Li Tsai, Houlong Town, TW;

Chui-Ya Peng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); B08B 3/04 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B08B 3/04 (2013.01); H01L 21/02057 (2013.01); H01L 21/68707 (2013.01); H01L 21/68764 (2013.01);
Abstract

In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.


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Wang, Tsui-Wei. (2021). Systems and methods for dry wafer transport (U.S. Patent No. 11139183). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11139183

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