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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11139089 B1

PDFFull Text
Date of Patent:
Oct. 05, 2021

Filed:

May. 29, 2020

Stretchable interconnects for flexible electronic surfaces

Applicant:

Alpha Assembly Solutions Inc., Waterbury, CT (US);

Inventors:

Narahari Pujari, Waterbury, CT (US);

Bawa Singh, Waterbury, CT (US);

Ravi Bhatkal, Waterbury, CT (US);

Siuli Sarkar, Waterbury, CT (US);

Anubhav Rustogi, Waterbury, CT (US);

Assignee:

Alpha Assembly Solutions Inc., Waterbury, CT (US);

Attorney:

Carmody Torrance Sandak & Hennessey LLP

Primary Examiner:

Christopher M Rodd

Int. Cl.
CPC ...
H01B 1/22 (2006.01); H05K 1/09 (2006.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); H05K 3/12 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/0014 (2013.01); B22F 1/0055 (2013.01); B22F 1/0074 (2013.01); B22F 1/025 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); B23K 35/362 (2013.01); B23K 35/3613 (2013.01); H05K 1/095 (2013.01); H05K 3/1216 (2013.01); H05K 3/1241 (2013.01); B22F 2301/255 (2013.01); B22F 2302/45 (2013.01); B22F 2304/10 (2013.01); H05K 1/189 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0203 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

Find Patent Forward Citations

Quick Actions:

Pujari, Narahari. (2021). Stretchable interconnects for flexible electronic surfaces (U.S. Patent No. 11139089). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11139089

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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