The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Sep. 25, 2018
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Shintaro Narioka, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B29C 43/56 (2006.01); B29C 59/02 (2006.01); G03F 9/00 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 43/56 (2013.01); B29C 59/02 (2013.01); G03F 9/7073 (2013.01); H01L 21/027 (2013.01); H01L 21/31058 (2013.01); H01L 21/31144 (2013.01);
Abstract

A shaping apparatus that shapes a composition on a substrate by using a mold, includes a substrate positioning mechanism for positioning the substrate, a mold positioning mechanism for positioning the mold, a dispenser for arranging the composition on a shot region of the substrate, and a gas supply for supplying a gas onto the substrate from a gas supply port in a state in which the substrate is driven by the substrate positioning mechanism. A flow rate of the gas supplied onto the substrate by the gas supply starts to decrease in a period during which the substrate is driven by the substrate positioning mechanism so that the shot region where the composition is arranged by the dispenser is moved under the mold.


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