The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Sep. 27, 2018
Applicant:
Himax Technologies Limited, Tainan, TW;
Inventors:
Chih-Sheng Chang, Tainan, TW;
Teng-Te Huang, Tainan, TW;
Shu-Hao Hsu, Tainan, TW;
Jun-Yu Zhan, Tainan, TW;
Jen-Hui Lai, Tainan, TW;
Assignee:
HIMAX TECHNOLOGIES LIMITED, Tainan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 13/00 (2006.01); H01L 27/146 (2006.01); C03B 23/22 (2006.01);
U.S. Cl.
CPC ...
G02B 13/0085 (2013.01); C03B 23/22 (2013.01); H01L 27/14627 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01);
Abstract
A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.