Chih-Sheng Chang

Title: Chih-Sheng Chang: Innovator in Metal Interconnect Structures

Introduction

Chih-Sheng Chang, an accomplished inventor based in Tainan, Taiwan, has made significant contributions to the field of electronics with 42 patents to his name. His work primarily focuses on innovative metal interconnect structures, which play a crucial role in the performance and reliability of electronic devices.

Latest Patents

Among Chih-Sheng Chang's latest patents is a "Metal interconnect structure having cap layer with different thicknesses and method for fabricating the same." This invention encompasses a metal interconnect structure that features a first metal interconnection in an inter-metal dielectric (IMD) layer on a substrate, a second metal interconnection on the first, and a cap layer made of conductive material situated between these interconnections. The design seeks to ensure that the top surface of the first metal interconnection aligns evenly with the top surface of the IMD layer.

Another notable invention is the "Interconnection structure and manufacturing method thereof." This patent covers an interconnection structure comprising a first, second, and third interconnection level, along with a super via structure that penetrates through the block layer and the second interconnection level to establish electrical connections between the conductive layers.

Career Highlights

Chih-Sheng Chang's professional journey includes working with prominent companies such as United Microelectronics Corporation and Sea Sonic Electronics Co., Ltd. His roles at these companies have contributed significantly to advancements in electronic interconnect technologies, reflecting his expertise and innovative mindset in the field.

Collaborations

Throughout his career, Chang has collaborated with several talented professionals, including Yuan-Fu Ko and Sheng-Chien Chou. These collaborations have fostered a dynamic environment for sharing ideas and pushing the boundaries of technology.

Conclusion

Chih-Sheng Chang's impressive portfolio of 42 patents demonstrates his commitment to advancing technology in the realm of electronic interconnect structures. His ongoing work and collaborations continue to make a meaningful impact on the electronics industry, paving the way for future innovations.