The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Sep. 10, 2018
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Koichi Shigematsu, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 41/00 (2006.01); B24B 49/12 (2006.01); B24B 7/22 (2006.01); H01L 21/304 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H04N 5/33 (2006.01); H04N 7/18 (2006.01);
U.S. Cl.
CPC ...
B24B 49/12 (2013.01); B24B 7/228 (2013.01); B24B 41/005 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01); H01L 22/26 (2013.01); H04N 5/33 (2013.01); H04N 7/183 (2013.01); H01L 21/67253 (2013.01);
Abstract

A processing apparatus includes a processing unit grinding or polishing the reverse side, which is exposed upwardly, of a wafer, an infrared camera unit capturing an image of the wafer from the reverse side thereof and acquiring an image including the face side of the wafer, an information register having information on a pattern of structural objects which a wafer to be processed is to have on the face side, registered therein, and a determining unit determining that the wafer to be determined is a wafer to be processed if the pattern of structural objects which a wafer to be processed is to have on the face side is found on the wafer to be determined before being processed by the processing unit.


Find Patent Forward Citations

Loading…