The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11134567 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 28, 2021

Filed:

Sep. 02, 2020
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Yu-Shen Chen, Taoyuan, TW;

I-Ta Tsai, Kaohsiung, TW;

Chien-Chih Chen, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/116 (2013.01); H05K 1/183 (2013.01); H05K 3/4038 (2013.01); H05K 3/4697 (2013.01);
Abstract

An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.


Find Patent Forward Citations

Chen, Yu-Shen. (2021). Embedded component structure and manufacturing method thereof (U.S. Patent No. 11134567). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11134567

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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