The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2021

Filed:

Oct. 16, 2018
Applicants:

Fu Ding Precision Component (Shen Zhen) Co., Ltd., Shenzhen, CN;

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Heng-Kang Wu, Shenzhen, CN;

Fu-Jin Peng, Shenzhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01);
Abstract

An electrical connector assembly for connecting the CPU and the printed circuit board, includes an electrical connector and a back plate respectively mounted upon two opposite surfaces of the printed circuit board. A fastening seat partially surrounds the connector for securing a heat sink which is downwardly seated upon the CPU for heat dissipation. The back plate forms a plurality of securing studs extending through the fastening seat. The heat sink further includes a plurality of tubular securing nuts respectively surrounded by the corresponding coil springs and secured to the corresponding securing studs in an adjustable manner so as to impose the downward force upon the heat sink to urge the heat sink to abut downwardly against the CPU for heat dissipation of the CPU.


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