The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Apr. 21, 2020
Disco Corporation, Tokyo, JP;
Byeongdeck Jang, Tokyo, JP;
Youngsuk Kim, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A method of manufacturing a packaged device chip includes the steps of forming a rewiring layer having rewiring patterns respectively in a plurality of areas demarcated on the rewiring layer by a projected dicing line on a first surface of a support member that has a second surface opposite the first surface, forming a dividing groove for dividing the rewiring layer in the rewiring layer along the projected dicing line, placing device chips in the respective areas on the rewiring layer and connecting the rewiring patterns and the device chips to each other, covering the device chips and the rewiring layer with molded resin while filling the dividing groove with the molded resin, and cutting the molded resin across an area disposed within the dividing groove and narrower than the dividing groove and forming packaged device chips.