The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Jun. 11, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Fu-Chun Hsieh, Hsinchu, TW;
Pei-Yi Su, Taichung, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
The present disclosure describes a leakage handling device and a method for handling a fluid leakage in a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus can include a lithography apparatus with a chuck configured to hold a substrate, and a photoresist feeder configured to dispatch a coating material on one or more areas of the substrate. The photoresist feeder can include a photoresist cartridge configured to output the coating material, a conduit fluidly connected to the photoresist cartridge, and a fluid leakage handling device disposed above the chuck, where the conduit can be configured to fluidly transport the coating material and circulate a coolant and the fluid leakage handling device can be configured to detect a fluid leakage from the conduit.