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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11131925 B1

PDFFull Text
Date of Patent:
Sep. 28, 2021

Filed:

Apr. 26, 2017

Water-soluble diacetylene, photolithography composition comprising water-soluble diacetylene monomer and conductive polymer, and fine pattern preparation method using same

Applicant:

Industry-university Cooperation Foundation Hanyang University, Seoul, KR;

Inventors:

Jongman Kim, Seoul, KR;

Chanwoo Lee, Seoul, KR;

Taegeun Kim, Daejeon, KR;

Kyungchan Uh, Bucheon-si, KR;

Assignee:

Industry-University Cooperation Foundation Hanyang University, Seoul, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/025 (2006.01); G03F 7/038 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); C07C 303/24 (2006.01); C08L 81/02 (2006.01); C07C 303/42 (2006.01); C08F 2/48 (2006.01); C07C 305/14 (2006.01); H01L 51/00 (2006.01); C07C 313/04 (2006.01); C08F 38/00 (2006.01); G03F 7/09 (2006.01); C07C 303/22 (2006.01); C07C 305/04 (2006.01); C07C 309/51 (2006.01); C09D 5/24 (2006.01); C09D 165/00 (2006.01); G03F 7/004 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); H01L 51/10 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
G03F 7/025 (2013.01); C07C 303/22 (2013.01); C07C 303/24 (2013.01); C07C 303/42 (2013.01); C07C 305/04 (2013.01); C07C 305/14 (2013.01); C07C 309/51 (2013.01); C07C 313/04 (2013.01); C08F 2/48 (2013.01); C08F 38/00 (2013.01); C08L 81/02 (2013.01); C09D 5/24 (2013.01); C09D 165/00 (2013.01); G03F 7/0045 (2013.01); G03F 7/038 (2013.01); G03F 7/093 (2013.01); G03F 7/162 (2013.01); G03F 7/2004 (2013.01); G03F 7/32 (2013.01); G03F 7/405 (2013.01); H01L 51/0023 (2013.01); H01L 51/0035 (2013.01); H01L 51/102 (2013.01); H01L 51/441 (2013.01); H01L 51/5206 (2013.01); H01L 51/5221 (2013.01); C08G 2261/135 (2013.01); C08G 2261/1424 (2013.01); C08G 2261/3223 (2013.01); C08G 2261/76 (2013.01); H01L 51/0037 (2013.01); H01L 2251/5338 (2013.01);
Abstract

Provided are a novel water-soluble diacetylene monomer, a composition for photolithography including the novel water-soluble diacetylene monomer and a conductive polymer, and a method of forming micropatterns using the composition. The water-soluble diacetylene monomer may not aggregate even when mixed with a water-soluble conductive polymer. Accordingly, a uniform composition for photolithography can be prepared by mixing a water-soluble conductive polymer with the diacetylene monomer, and micropatterns can be formed using the composition. More particularly, when the composition is formed into a thin film and then is irradiated with light, only light-irradiated portions of the diacetylene monomer are selectively crosslinked due to photopolymerization, thereby resulting in insoluble negative-type micropatterns.

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