The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Jun. 20, 2013
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventor:
Dominik Treiblmayr, Kirchdorf am Inn, AT;
Assignee:
EV GROUP E. THALLNER GMBH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); G03F 7/20 (2006.01); G03F 7/00 (2006.01); C23C 14/06 (2006.01); C23C 14/22 (2006.01); C23C 16/06 (2006.01); C23C 16/22 (2006.01); B29C 43/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45525 (2013.01); C23C 14/06 (2013.01); C23C 14/22 (2013.01); C23C 16/06 (2013.01); C23C 16/22 (2013.01); G03F 7/0002 (2013.01); G03F 7/20 (2013.01); B29C 2043/025 (2013.01); G03F 7/0005 (2013.01); G03F 7/0035 (2013.01); G03F 2007/2067 (2013.01);
Abstract
A method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures are coated at least partially with a coating. In addition, the invention relates to a corresponding structural die as well as a device for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the device has coating means for coating the die structures.