The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Feb. 21, 2018
Mitsubishi Materials Corporation, Tokyo, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0≤f1=Cu+0.8×Si+P+Pb≤80.8; and 60.2≤f2=Cu−4.7×Si−P+0.5×Pb≤61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29≤κ≤60; 0≤γ≤0.3; β=0; 0≤μ≤1.0; 98.6≤f3=α+κ; 99.7≤f4=α+κ+γ+μ; 0≤f5=γ+μ≤1.2; and 30≤f6=κ+6×γ+0.5×μ≤62. The long side of the γ phase is at most 25 μm, the long side of the μ phase is at most 20 μm, and the κ phase is present within the α phase.